iPhone 8 Plus teardown detailed process and analysis report

For purchase report, please contact: Mams Consulting Wang Hao Tel Email: wangyi#memsconsulting.com(#换@@) iPhone 8 Plus is Apple's eleventh generation smartphone, released on September 13, 2017 in Beijing time. . The iPhone 8 Plus continues the previous generation design, but thanks to the addition of wireless charging, the metal back cover on the back is back to the original classic glass back cover design.

The return of the iPhone 8 Plus glass back cover also makes it unnecessary to add additional injection molding strips to the back cover. The entire back cover is more integrated, but the rear camera is still raised.

The iPhone 8 Plus smartphone is disassembled from the screen. When opened, it can be seen that its internal structure is not much different from the previous generation 7 Plus.

The waterproofing of the iPhone 8 Plus smartphone screen is achieved by the foam glue on the left and right sides and the white glue on the upper and lower parts.

The iPhone 8 Plus integrates an earpiece, front camera and sensor module, metal mounting plate and fingerprint recognition sensor on the screen panel.

The iPhone 8 Plus battery is secured by four easy-to-pull glues with a fixed area as shown:

The size of the iPhone 8 Plus vibrator is quite large compared to other regular mobile phones, and its vibration feedback performance is good.

After removing the iPhone 8 Plus motherboard, the shape of the motherboard is almost the same as that of the 7 Plus. The difference may be the upgrade of that processor.

The iPhone 8 Plus has a wireless charging coil in the center of the back cover, which should be the biggest difference from the previous generation.

After removing the shield, you can see the IC on the iPhone 8 Plus motherboard. Main IC on the front of the motherboard (below): Green-RF RF chip red-MURATA-339S00399-WiFi/Bluetooth chip purple-Dialog-338S00309-Power management chip blue-Cirrus Logic-338S00248-Audio decoding chip Cyan-Toshiba-TSBL227- 64GB Flash Chip Yellow - Qualcomm-WTR5975 - RF Transceiver

Main IC on the back of the motherboard (below): Green - Power Amplifier Module Cyan - Touch Screen Controller Blue - Qualcomm-MDM9655 - Baseband Chip Red - A11 Bionic Processor Rose - Cirrus Logic-338S00306 - Audio Amplifier

The iPhone 8 Plus rear-mounted 12-megapixel wide-angle and telephoto dual-lens camera is the same as the 7 Plus, with no upgrades.

The iPhone 8 Plus has a battery capacity of 2691 mAh, while the 7 Plus has a battery capacity of 2900 mAH. However, this does not affect the endurance of the 8 Plus. The official website says that its usage time is roughly the same as that of the 7 Plus.

The iPhone 8 Plus fingerprint recognition is a non-pressable design and is identical to the 7 Plus.

The iPhone 8 Plus rear case is not a full glass design, as seen in the metal panel below.

Summary: Compared with the previous generation, the iPhone 8 Plus upgrades some modules, such as the new A11 bionic processor, supports wireless charging, retro glass back cover and antenna design similar to the classic iPhone4, reducing power but not reducing battery life, etc. In view of it, it still can't escape the shadow of 7 Plus, such as no change in the screen, and the change of the rear double camera. Product technical analysis services: First: machine analysis report: product technology highlights, parameter information, packaging specifications, machine appearance, disassembly steps, motherboard / soft board analysis, battery / camera / display analysis, cost reference information. Two: IC device analysis report: package level analysis, device process analysis, material structure analysis, reliability / failure test. If you need to purchase the "iPhone 8 Plus Smartphone" disassembly analysis report, as well as IC and MEMS device analysis report, please send an email to wangyi#memsconsulting.com (# replaced by @).