China's LED industry has developed to the present day. In the entire industrial chain of materials, epitaxial wafer growth, chip manufacturing, packaging and application, people pay more attention to key process equipment while paying attention to process technology. The difference between the LED industry and other industries lies in the continuous improvement of the technology of LED products, but the price is getting lower and lower. This requires both automation equipment capable of producing high-end LED products and investment costs, which gives domestic equipment. Providing a once-in-a-lifetime market opportunity.
LED epitaxial wafers and equipment needed for chip manufacturing are relatively simpler than integrated circuit chip manufacturing equipment. In China, except for some key equipment (such as MOCVD, plasma etching machine, photoelectric characteristic tester), most of the equipment can be produced. Independent production, the technical reliability of the equipment has reached the level of similar equipment abroad. Such as slicer, lithography machine, cleaning and drying machine, probe test bench produced by the 45th Research Institute of China Electronics Technology Group, etc., ion implanter, epitaxial furnace, etc. produced by the 48th Research Institute of China Power Technology Group , have played a role in the production line of integrated circuits and electronic components. China's LED packaging equipment manufacturing and complete line supporting capacity and foreign countries have a large gap, in addition to forty-five production of dicing machines and some auxiliary equipment can meet the production line use, the rest of the large number (such as chip bonding machine, wire bonding machine, Test equipment, tape machines, etc.) Automation equipment still relies on imports.
Therefore, some suggestions are made for the localization of LED production equipment. First, the basic ideas, related equipments that have been developed by the state (such as MOCVD, dicing machine, etc.) and equipment units, can be borrowed. Give certain adaptability improvements and industrialization funding support to make it serve the industry as soon as possible; immediately start some key equipments such as chip bonders, chip sorters, and chip testers that have not yet been developed, and propose Industrialization target requirements; for the equipment manufacturing technology that can be obtained from abroad, the state gives the cooperation unit a certain amount of financial support, accelerates the industrialization and localization of equipment; and supports other non-critical equipment through the support of three technical expenses. Large production requirements. By strengthening the work in the above aspects, I believe that after about two to three years, China will be able to supply the entire line of LED equipment.
Secondly, in terms of organizational form, it is recommended to establish a national LED equipment manufacturing base and an LED production process incubation base to closely integrate the development and production processes of LED equipment to form a complete line construction capability of equipment and technology. With the support of the state, through the joint efforts of the state, LED manufacturing enterprises and equipment and materials manufacturing, China's LED equipment, materials, manufacturing and application complex with incubator function will be established. To establish a LED equipment development and manufacturing base in China, in the process of equipment development and manufacturing, special attention should be paid to the research and promotion of LED standard production processes. For this purpose, production units with strong process technology development and application capabilities are required to cooperate.
LED epitaxial wafers and equipment needed for chip manufacturing are relatively simpler than integrated circuit chip manufacturing equipment. In China, except for some key equipment (such as MOCVD, plasma etching machine, photoelectric characteristic tester), most of the equipment can be produced. Independent production, the technical reliability of the equipment has reached the level of similar equipment abroad. Such as slicer, lithography machine, cleaning and drying machine, probe test bench produced by the 45th Research Institute of China Electronics Technology Group, etc., ion implanter, epitaxial furnace, etc. produced by the 48th Research Institute of China Power Technology Group , have played a role in the production line of integrated circuits and electronic components. China's LED packaging equipment manufacturing and complete line supporting capacity and foreign countries have a large gap, in addition to forty-five production of dicing machines and some auxiliary equipment can meet the production line use, the rest of the large number (such as chip bonding machine, wire bonding machine, Test equipment, tape machines, etc.) Automation equipment still relies on imports.
Therefore, some suggestions are made for the localization of LED production equipment. First, the basic ideas, related equipments that have been developed by the state (such as MOCVD, dicing machine, etc.) and equipment units, can be borrowed. Give certain adaptability improvements and industrialization funding support to make it serve the industry as soon as possible; immediately start some key equipments such as chip bonders, chip sorters, and chip testers that have not yet been developed, and propose Industrialization target requirements; for the equipment manufacturing technology that can be obtained from abroad, the state gives the cooperation unit a certain amount of financial support, accelerates the industrialization and localization of equipment; and supports other non-critical equipment through the support of three technical expenses. Large production requirements. By strengthening the work in the above aspects, I believe that after about two to three years, China will be able to supply the entire line of LED equipment.
Secondly, in terms of organizational form, it is recommended to establish a national LED equipment manufacturing base and an LED production process incubation base to closely integrate the development and production processes of LED equipment to form a complete line construction capability of equipment and technology. With the support of the state, through the joint efforts of the state, LED manufacturing enterprises and equipment and materials manufacturing, China's LED equipment, materials, manufacturing and application complex with incubator function will be established. To establish a LED equipment development and manufacturing base in China, in the process of equipment development and manufacturing, special attention should be paid to the research and promotion of LED standard production processes. For this purpose, production units with strong process technology development and application capabilities are required to cooperate.
1.0mm Ribbon Connector is commonly used in electronic devices to connect ribbon cables. It is a type of connector that has a pitch of 1.0mm, which means that the pins are spaced 1.0mm apart. This connector is designed to be used with ribbon cables that have a similar pitch.
The 1.0mm Ribbon Connector is typically used in applications where a high-density connection is required. It is commonly used in computer systems, printers, and other electronic devices that require a high-speed data transfer.
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