[Text / high-tech LED Gan Qin] Cost control can be said to be the topic of ensuring that the profit rate of the enterprise has never changed. The packaging, as the backbone of the LED industry chain, plays an important role, and the cost proportion is increasing year by year. In order to meet the needs of lighting companies, packaging companies are considering how to improve performance while reducing costs.
In the packaging process, in order to reduce the low cost on the premise of ensuring the quality of products, most companies work hard from the supply chain and technological innovation. First, in the control of the supply chain, it has formed strategic cooperation with upstream manufacturers to reduce costs and form scale. Secondly, through optimization of product structure design, the cost of failure is minimized and the concentration and consistency of products are improved.
Shao Pengrui said that at present, miniaturized packaging faces several technical difficulties: product and process design are more difficult; high reliability requirements require less failure tolerance for lamp replacement, leakage, etc., and require high solderability. The performance of PAD is small and the density is high, facing the problem of false welding; the surface level of the lamp body is required to be high.
From the perspective of packaging technology development, CSP, which is increasingly miniaturized in product size, is considered to be the latest generation of cost-effective products. However, Shao Pengrui believes that the technology is currently not mature.
Shao Pengrui said that the CSP package product area is 1.2 times the chip area, and does not involve specific packaging technology. He believes that CSP is not equal to flip-chip package chip package, and there is no specific restriction on what kind of chip to use. Flip-chip-based substrateless package has the problems of high cost, low light extraction efficiency, immature packaging process, low compatibility of product application, etc. At present, the technology is not mature enough and needs to develop for a certain period of time.
In order to solve the above problems, the Hummingbird series 1010 device launched by Jingtai has adopted NCSP technology, which makes the package product area close to or larger than 1.2 times the chip area. Shao Pengrui introduced that the hummingbird series products are based on CCVT (Copper Cylinder Via Technology) copper column via technology, which has the advantages of high air tightness, weldability and high heat, and has obtained ZL.201410479272.4.X, ZL.201420538849 .X patent.
Shao Pengrui said that the company has already applied the technology to the small-pitch field, and the future will extend to the field of lighting and backlighting, opening up a blue ocean for LEDs.
In the packaging process, in order to reduce the low cost on the premise of ensuring the quality of products, most companies work hard from the supply chain and technological innovation. First, in the control of the supply chain, it has formed strategic cooperation with upstream manufacturers to reduce costs and form scale. Secondly, through optimization of product structure design, the cost of failure is minimized and the concentration and consistency of products are improved.
Shao Pengrui said that at present, miniaturized packaging faces several technical difficulties: product and process design are more difficult; high reliability requirements require less failure tolerance for lamp replacement, leakage, etc., and require high solderability. The performance of PAD is small and the density is high, facing the problem of false welding; the surface level of the lamp body is required to be high.
From the perspective of packaging technology development, CSP, which is increasingly miniaturized in product size, is considered to be the latest generation of cost-effective products. However, Shao Pengrui believes that the technology is currently not mature.
Shao Pengrui said that the CSP package product area is 1.2 times the chip area, and does not involve specific packaging technology. He believes that CSP is not equal to flip-chip package chip package, and there is no specific restriction on what kind of chip to use. Flip-chip-based substrateless package has the problems of high cost, low light extraction efficiency, immature packaging process, low compatibility of product application, etc. At present, the technology is not mature enough and needs to develop for a certain period of time.
In order to solve the above problems, the Hummingbird series 1010 device launched by Jingtai has adopted NCSP technology, which makes the package product area close to or larger than 1.2 times the chip area. Shao Pengrui introduced that the hummingbird series products are based on CCVT (Copper Cylinder Via Technology) copper column via technology, which has the advantages of high air tightness, weldability and high heat, and has obtained ZL.201410479272.4.X, ZL.201420538849 .X patent.
Shao Pengrui said that the company has already applied the technology to the small-pitch field, and the future will extend to the field of lighting and backlighting, opening up a blue ocean for LEDs.
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