Is there a single chip memory?

Tessera Technologies, Inc. Invensas Corporation, a wholly-owned subsidiary, announced today that it will demonstrate its new multi-face-down memory packaging technology "xFD" at Intel's Fall IDF 2011 in mid-April this year, more than the traditional Dual Die Package (DDP). further. Maybe someday in the future, we will be able to see the memory of only two chips and even one chip.

xFD stands for multi-die face-down, a wirebond-based multi-die packaging technology that packages multiple DRAM ICs face-down in a single chip and uses a similar window-BGA package. Short wire structure, known as:

- To increase capacity, the overall component size is 25-35% smaller than the conventional solution, mainly because the vertical height is greatly reduced;

- Enhanced electrical performance, and at the same time improve the yield by 50-70% due to balanced die performance.

- 20-30% heat transfer efficiency over traditional dual die package (DDP).

xFD technology now has two forms, one is "DFD" (Dual Face Down), single chip package two x4/x8/x16 DRAM die, in which x4/x8 version uses 104 BGA package, size 11.5 x 11.5 mm, x16 version It is packaged in a 136 BGA and measures 11.5 x 11.5 mm or 11.5 x 14 mm.

The second is the "QFD" (Quad Face Down), a single chip package of four x8/x15 DRAM die, 256 BGA package size 16.2 x 16.2 mm.

If you are worried about the memory performance of this package, Invensas claims that it can run at a high frequency of 2133MHz and has been fully debugged and certified.

Invensas xFD packaging technology is mainly for servers, data centers, notebooks and other mobile devices, but it is still unknown when it will be available on the market.